Paul Smith, has more than 30 years of hands-on project management with an unsurpassed record of more than 200 projects implemented on time and on budget for Fortune 500 and Forbes 100 companies. Projects ranged from chip design, processor integration, operating system and software architecting, thin film development and opt-electronics development with a return on investment exceeding $100M. Intellectual property development includes 10 patents and patent applications with more than 60 claims ranging from chip design, chip fabrication techniques, operating system software, thin-film for hydrogen storage, and hydrogen cooling systems. He has experience with laser interaction with materials with an emphasis on solid-state laser-based systems effecting material phase change in the presence of hydrogen . He has been granted multiple patents for his pioneering work with nanostructures and his discoveries have been deemed transformational by the U.S. Department of Energy. He completed undergraduate and graduate studies at Pennsylvania State University and received a doctorate from Temple University, a diploma-engineer from Ludwig Maximilian University, and was a fellow at the University of Strasbourg. He was instrumental in enhancing computer chip design and fabrication along with software integration for IBM, Digital Equipment Corporation, Hitachi, and Unisys; and has successfully managed military and commercial projects in excess of a billion dollars.
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